1 Layers Single Sided,2 to 18 Layer
2 Board material type FR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg, Rogers and more
3 Compound material lamination 4 to 6 layers
4 Maximum dimension 610 x 1,100mm
5 Dimension tolerance ±0.13mm
6 Board thickness coverage 0.2 to 6.00mm
7 Board thickness tolerance ±10%
8 DK thickness 0.076 to 6.00mm
9 Minimum line width 0.10mm
10 Minimum line space 0.10mm
11 Outer layer copper thickness 8.75 to 175µm
12 Inner layer copper thickness 17.5 to 175µm
13 Drilling hole diameter (mechanical drill) 0.25 to 6.00mm
14 Finished hole diameter (mechanical drill) 0.20 to 6.00mm
15 Hole diameter tolerance (mechanical drill) 0.05mm
16 Hole position tolerance (mechanical drill) 0.075mm
17 Laser drill hole size 0.10mm
18 Board thickness and hole diameter ratio 10:1
19 Solder mask type Green, Yellow, Black, Purple, Blue, White and Red
20 Minimum solder mask Ø0.10mm
21 Minimum size of solder mask separation ring 0.05mm
22 Solder mask oil plug hole diameter 0.25 to 0.60mm
23 Impedance control tolerance ±10%
24 Surface finish Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger