* Min. IC Pitch 0.30mm(12mil)
*Foot Pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
*Min. Chip Placement 01005
*Max. PCB Size 410mm * 600mm(16.2" * 23.6")
*Min. PCB Thickness 0.35mm(13.8mil)
*Maximum BGA Size 74mm * 74mm(2.9" * 2.9")
*BGA Ball Pitch 1mm ~ 3mm(4mil ~ 12mil)
*BGA Ball Diameter 0.4mm ~ 1mm(16mil ~ 40mil)
*QFP Lead Pitch 0.38mm ~ 2.54mm(15mil ~ 100mil)
*Flammability UL-94V-0
*Package Anti-static Bubble Bag & Carton